Publié le 5 novembre 2026 · Expire le 3 janvier 2027
Description du poste
• Manages a team of sales personnel to achieve market leadership in product, customer and territory sales
• Serves as a clear example to subordinates of desired performance and takes actions to foster co-operative working relationships among subordinates.
Qualifications
• 10 years of combined experience in semiconductor packaging industry and precision machining
• A degree in Mechanical, Manufacturing or Industrial Engineering or related
• Good understanding in semiconductor toolings used in Die-Attach and Wire Bond Process